Publications
Journal Article
- B. Guo, S. Z. Ahmed, X. Xue, A. K. Rockwell, J. Ha, S. Lee, B. Liang, A. H. Jones, J. A. McArthur, S. H. Kodati, T. J. Ronningen, S. Krishna, J. Kim, S. R. Bank, A. W. Ghosh, and J. C. Campbell, "Temperature dependence of avalanche breakdown of AlGaAsSb and AlInAsSb avalanche photodiodes," Journal of Lightwave Technology, Jun 2022.
- J. Zheng, S. Z. Ahmed, Y. Yuan, A. H. Jones, Y. Tan, A. K. Rockwell, S. D. March, S. R. Bank, A. W. Ghosh, and J. C. Campbell, "Full band Monte Carlo simulation of AlInAsSb digital alloys," InfoMat, vol. 2, no. 06, pp. 1236-1240, Nov 2020.
- J. Zheng, S. Z. Ahmed, Y. Yuan, A. H. Jones, Y. Tan, A. K. Rockwell, S. D. March, S. R. Bank, A. W. Ghosh, and J. C. Campbell, "Full band Monte Carlo simulation of AlInAsSb digital alloys," InfoMat, vol. 2, no. 6, pp. 1236-1240, Mar 2020.
- R. K. Vinnakota, Z. Dong, A. F. Briggs, S. R. Bank, D. Wasserman, and D. A. Genov, "Plasmonic electro-optic modulator based on degenerate semiconductor interfaces," Nanophotonics, Feb 2020.
- J. Zheng, A. H. Jones, Y. Tan, A. K. Rockwell, S. D. March, S. Z. Ahmed, C. A. Dukes, A. W. Ghosh, S. R. Bank, and J. C. Campbell, "Characterization of band offsets in AlxIn1-xAsySb1-y alloys with varying Al composition," Applied Physics Letters, vol. 115, no. 12, pp. 122105, Sep 2019.
- Z. Dong, R. K. Vinnakota, A. F. Briggs, L. J. Nordin, S. R. Bank, D. A. Genov, and D. Wasserman, "Electrical modulation of degenerate semiconductor plasmonic interfaces," Journal of Applied Physics, vol. 126, no. 4, pp. 043101, Jul 2019.
- K. Appaiah, S. Zisman, A. Kumar. Das, S. Vishwanath, and S. R. Bank, "Analysis of Laser and Detector Placement in Incoherent MIMO Multimode Fiber Systems," IEEE J. Opt. Commun. Netw., vol. 6, no. 4, pp. 1, Apr 2014.
Conference Paper
- R. K. Vinnakota, Z. Dong, A. F. Briggs, S. R. Bank, D. Wasserman, and D. A. Genov, "Excitation and Active Control of Charge Density Waves at Degenerately Doped PN++ Junctions," Bulletin of the American Physical Society, Las Vegas, NV, Mar 2023.