Publications
Journal Article
- E. S. Walker, S. Ryul. Na, D. Jung, S. D. March, J. Kim, T. Trivedi, W. Li, L. Tao, M. L. Lee, K. M. Liechti, D. Akinwande, and S. R. Bank, "Large-Area Dry Transfer of Single-Crystalline Epitaxial Bismuth Thin Films," Nano Letters, vol. 16, no. 11, pp. 6931-6938, Oct 2016.
- Z. Wu, G. Kelp, M. N. Yogeesh, W. Li, K. M. McNicholas, A. F. Briggs, B. B.Rajeeva, D. Akinwande, S. R. Bank, G. Shvets, and Y. Zheng, "Dual-Band Moire Metasurface Patches for Multifunctional Biomedical Applications," Nanoscale, vol. 8, pp. 18461, Sep 2016.
- Z. Wu, W. Li, M. N. Yogeesh, S. Jung, A. Lynghi. Lee, K. M. McNicholas, A. F. Briggs, S. R. Bank, M. A. Belkin, D. Akinwande, and Y. Zheng, "Tunable Graphene Metasurfaces with Gradient Features by Self-Assembly-Based Moire Nanosphere Lithography," Advanced Optical Materials, Aug 2016.
- K. Appaiah, S. Zisman, A. Kumar. Das, S. Vishwanath, and S. R. Bank, "Analysis of Laser and Detector Placement in Incoherent MIMO Multimode Fiber Systems," IEEE J. Opt. Commun. Netw., vol. 6, no. 4, pp. 1, Apr 2014.
Conference Paper
- R. C. White, M. K. Bergthold, A. J. Muhowski, Y. Wang, I. Okoro, D. Wasserman, and S. R. Bank, "Lattice-Matched InAsSbBi Photodetectors for Long-Wave Infrared Sensing," 81st Device Research Conf. (DRC), Santa Barbara, CA, Jun 2023.
- R. C. White, M. K. Bergthold, I. Okoro, Y. Wang, L. J. Nordin, A. J. Muhowski, A. F. Ricks, D. Wasserman, and S. R. Bank, "Towards Lattice-Matched Narrow Bandgap InAsSbBi Photodetectors," 36th North American Molecular Beam Epitaxy Conf. (NAMBE), Rehoboth Beach, DE, Sep 2022.
- E. S. Walker, S. Ryul. Na, D. Jung, S. D. March, Y. Liu, T. Trivedi, W. Li, L. Tao, M. L. Lee, K. M. Liechti, D. Akinwande, and S. R. Bank, "Growth and Transfer of Epitaxial Bismuth Films for Flexible Electronics," 58th Electronic Materials Conf. (EMC), Newark, DE, Jun 2016.
- E. S. Walker, W. Li, S. Guchhait, M. N. Yogeesh, F. He, Y. Wang, D. Akinwande, and S. R. Bank, "In Situ Oxidation of Bismuth Thin Films Grown by Molecular Beam Epitaxy for Device Applications," 57th Electronic Materials Conf. (EMC), Columbus, OH, Jun 2015.