Publications
Journal Article
- D. Chen, S. D. March, A. H. Jones, Y. Shen, A. A. Dadey, K. Sun, J. A. McArthur, A. M. Skipper, X. Xue, B. Guo, J. Bai, S. R. Bank, and J. C. Campbell, "Photon-trapping-enhanced avalanche photodiodes for mid-infrared applications," Nature Photonics, May 2023.
- D. Chen, K. Sun, Y. Chen, A. H. Jones, A. A. Dadey, B. Guo, J. A. McArthur, S. R. Bank, and J. C. Campbell, "Frequency behavior of AlInAsSb nBn photodetectors and the development of an equivalent circuit model," Optics Express, vol. 30, no. 14, pp. 25262, Jul 2022.
- B. Guo, S. Z. Ahmed, X. Xue, A. K. Rockwell, J. Ha, S. Lee, B. Liang, A. H. Jones, J. A. McArthur, S. H. Kodati, T. J. Ronningen, S. Krishna, J. Kim, S. R. Bank, A. W. Ghosh, and J. C. Campbell, "Temperature dependence of avalanche breakdown of AlGaAsSb and AlInAsSb avalanche photodiodes," Journal of Lightwave Technology, Jun 2022.
- S. Rahimi, E. M. Krivoy, J. Lee, M. E. Michael, S. R. Bank, and D. Akinwande, "Temperature dependence of the electrical resistivity of LaLuAs," AIP Advances, vol. 3, no. 8, pp. 082102, Jul 2013.
Conference Paper
- R. H. El-Jaroudi, A. A. Dadey, X. Xue, A. H. Jones, B. Guo, J. C. Campbell, and S. R. Bank, "Reducing III-V avalanche photodiode noise through the introduction of boron," 79th Device Research Conf. (DRC), Virtual, Jun 2021.
- R. H. El-Jaroudi, A. H. Jones, A. A. Dadey, B. Guo, X. Xue, J. C. Campbell, and S. R. Bank, "Growth of B-III-V alloys for GaAs-based optoelectronic devices," 62nd Electronic Materials Conf. (EMC), Virtual, Jun 2021.
- S. Rahimi, E. M. Krivoy, J. Lee, S. R. Bank, and D. Akinwande, "Temperature and Thickness Dependence of Electrical Resistivity of LaLuAs," 55th Electronic Materials Conf. (EMC), South Bend, IN, Jun 2013.
- S. Vaithilingam, I. O. Wygant, S. D. Sifferman, X. Zhuang, Y. Furukawa, O. Oralkan, S. Keren, S. S. Gambhir, and B. T. Khuri-Yakub, "Tomographic Photoacoustic Imaging Using Capacitive Micromachined Ultrasonic Transducer (CMUT) Technology," 2006 IEEE Ultrasonics Symposium, Ultrasonics Symposium, 2006. IEEE, pp. 397-400, Oct 2006.