Publications
Journal Article
- I. A. Gulyas, C. A. Stephenson, Q. Meng, S. R. Bank, and M. A. Wistey, "The Carbon State in Dilute Germanium Carbides," Journal of Applied Physics, vol. 129, no. 5, pp. 055701, Feb 2021.
- J. Jeong, X. Meng, A. K. Rockwell, S. R. Bank, W. Hsieh, J. Lin, and Y. Wang, "Picosecond transient thermoreflectance for thermal conductivity characterization," Nanoscale and Microscale Thermophysical Engineering, vol. 0, no. 0, Feb 2019.
- K. Chen, X. Meng, F. He, Y. Zhou, J. Jeong, N. T. Sheehan, S. R. Bank, and Y. Wang, "Comparison between Grating Imaging and Transient Grating Techniques on Measuring Carrier Diffusion in Semiconductor," Nanoscale and Microscale Thermophysical Engineering, vol. 22, no. 4, pp. 348-359, Aug 2018.
- J. Jeong, K. Chen, E. S. Walker, N. Roy, F. He, P. Liu, G. Willson, M. Cullinan, S. R. Bank, and Y. Wang, "In-Plane Thermal Conductivity Measurement with Nanosecond Grating Imaging Technique," Nanoscale and Microscale Thermophysical Engineering, vol. 22, no. 2, pp. 83-96, Dec 2017.
- R. Kudrawiec, P. Poloczek, J. Misiewicz, H. P. Bae, T. Sarmiento, S. R. Bank, H. B. Yuen, M. A. Wistey, and J. S. Harris, "Contactless electroreflectance of GaInNAsSb/GaNAs/GaAs quantum wells emitting at 1. 5\—1. 65 \µm: Broadening of the fundamental transition," APL, vol. 94, no. 3, pp. 031903, Jan 2009.
Conference Paper
- Q. Meng, R. H. El-Jaroudi, I. A. Gulyas, R. C. White, K. M. McNicholas, T. Dey, S. R. Bank, and M. A. Wistey, "Effect of B-In interactions on the band structure and optical properties of BGa(In)As," 62nd Electronic Materials Conf. (EMC), Columbus, OH, Jun 2020.
- J. Jeong, K. Chen, E. S. Walker, S. R. Bank, and Y. Wang, "Nanosecond Grating Imaging Technique for Measuring Thermal Transport Properties," 59th Electronic Materials Conf. (EMC), South Bend, IN, Jun 2017.
- D. J. Ironside, E. M. Krivoy, V. D. Dasika, E. S. Walker, K. Nguyen, J. Jeong, Y. Wang, and S. R. Bank, "Tailored III-V Metamorphic Buffer Layers utilizing Embedded Rare Earth Monopnictides for Optoelectronic Applications," 57th Electronic Materials Conf. (EMC), Columbus, OH, Jun 2015.