Publications

Displaying 7 publications
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Journal Article

  1. J. Jeong, X. Meng, A. K. Rockwell, S. R. Bank, W. Hsieh, J. Lin, and Y. Wang, "Picosecond transient thermoreflectance for thermal conductivity characterization," Nanoscale and Microscale Thermophysical Engineering, vol. 0, no. 0, Feb 2019. Digital object identifier
  2. K. Chen, X. Meng, F. He, Y. Zhou, J. Jeong, N. T. Sheehan, S. R. Bank, and Y. Wang, "Comparison between Grating Imaging and Transient Grating Techniques on Measuring Carrier Diffusion in Semiconductor," Nanoscale and Microscale Thermophysical Engineering, vol. 22, no. 4, pp. 348-359, Aug 2018. Digital object identifier
  3. J. Jeong, K. Chen, E. S. Walker, N. Roy, F. He, P. Liu, G. Willson, M. Cullinan, S. R. Bank, and Y. Wang, "In-Plane Thermal Conductivity Measurement with Nanosecond Grating Imaging Technique," Nanoscale and Microscale Thermophysical Engineering, vol. 22, no. 2, pp. 83-96, Dec 2017. Digital object identifier
  4. D. Jung, J. Faucher, S. Mukherjee, A. Akey, D. J. Ironside, M. Cabral, X. Sang, J. Lebeau, S. R. Bank, T. Buonassisi, O. Moutanabbir, and M. L. Lee, "Highly tensile-strained Ge/InAlAs nanocomposites," Nature Communications, vol. 8, pp. 14204, Jan 2017. Digital object identifier

Conference Paper

  1. R. C. White, Q. Meng, M. Lopez, A. Ponnekanti, L. J. Nordin, A. J. Muhowski, D. Wasserman, S. R. Bank, and M. A. Wistey, "Growth and Characterization of InSbBi: A (Potentially) Not So Highly Mismatched Alloy for Wavelength Extension on InSb," 21st International Conference on Molecular Beam Epitaxy (ICMBE), Virtual, Sep 2021.
  2. J. Jeong, K. Chen, E. S. Walker, S. R. Bank, and Y. Wang, "Nanosecond Grating Imaging Technique for Measuring Thermal Transport Properties," 59th Electronic Materials Conf. (EMC), South Bend, IN, Jun 2017.
  3. D. J. Ironside, E. M. Krivoy, V. D. Dasika, E. S. Walker, K. Nguyen, J. Jeong, Y. Wang, and S. R. Bank, "Tailored III-V Metamorphic Buffer Layers utilizing Embedded Rare Earth Monopnictides for Optoelectronic Applications," 57th Electronic Materials Conf. (EMC), Columbus, OH, Jun 2015.