Publications
Journal Article
- T. Kim, A. M. Skipper, S. R. Bank, and E. T. Yu, "Nanoscale electrical conductance and leakage currents in etched and selective-area regrown GaAs pn junctions," Journal of Applied Physics, vol. 137, no. 7, pp. 075702, Feb 2025.
- A. M. Garcia, A. M. Skipper, D. J. Ironside, and S. R. Bank, "Experimentally calibrated modeling of periodic supply epitaxy for selective area growth by molecular beam epitaxy," Crystal Growth & Design, vol. 25, no. 4, pp. 963-969, Jan 2025.
- R. C. White, M. Bergthold, A. Muhowski, L. Nordin, I. Okoro, H. Hijazi, L. Feldman, D. Wasserman, and S. R. Bank, "Molecular beam epitaxy of InAsSbBi lattice-matched to InSb toward long-wave infrared sensing," Crystal Growth & Design, vol. 24, no. 21, pp. 8727-8735, Oct 2024.
- J. Jeong, X. Meng, A. K. Rockwell, S. R. Bank, W. Hsieh, J. Lin, and Y. Wang, "Picosecond transient thermoreflectance for thermal conductivity characterization," Nanoscale and Microscale Thermophysical Engineering, vol. 0, no. 0, Feb 2019.
- K. Chen, X. Meng, F. He, Y. Zhou, J. Jeong, N. T. Sheehan, S. R. Bank, and Y. Wang, "Comparison between Grating Imaging and Transient Grating Techniques on Measuring Carrier Diffusion in Semiconductor," Nanoscale and Microscale Thermophysical Engineering, vol. 22, no. 4, pp. 348-359, Aug 2018.
- J. Jeong, K. Chen, E. S. Walker, N. Roy, F. He, P. Liu, G. Willson, M. Cullinan, S. R. Bank, and Y. Wang, "In-Plane Thermal Conductivity Measurement with Nanosecond Grating Imaging Technique," Nanoscale and Microscale Thermophysical Engineering, vol. 22, no. 2, pp. 83-96, Dec 2017.
Conference Paper
- J. Jeong, K. Chen, E. S. Walker, S. R. Bank, and Y. Wang, "Nanosecond Grating Imaging Technique for Measuring Thermal Transport Properties," 59th Electronic Materials Conf. (EMC), South Bend, IN, Jun 2017.
- D. J. Ironside, E. M. Krivoy, V. D. Dasika, E. S. Walker, K. Nguyen, J. Jeong, Y. Wang, and S. R. Bank, "Tailored III-V Metamorphic Buffer Layers utilizing Embedded Rare Earth Monopnictides for Optoelectronic Applications," 57th Electronic Materials Conf. (EMC), Columbus, OH, Jun 2015.