Publications

Displaying 7 publications
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Journal Article

  1. B. Guo, S. Z. Ahmed, X. Xue, A. K. Rockwell, J. Ha, S. Lee, B. Liang, A. H. Jones, J. A. McArthur, S. H. Kodati, T. J. Ronningen, S. Krishna, J. Kim, S. R. Bank, A. W. Ghosh, and J. C. Campbell, "Temperature dependence of avalanche breakdown of AlGaAsSb and AlInAsSb avalanche photodiodes," Journal of Lightwave Technology, Jun 2022. Digital object identifier
  2. I. A. Gulyas, C. A. Stephenson, Q. Meng, S. R. Bank, and M. A. Wistey, "The Carbon State in Dilute Germanium Carbides," Journal of Applied Physics, vol. 129, no. 5, pp. 055701, Feb 2021. Digital object identifier
  3. J. Zheng, S. Z. Ahmed, Y. Yuan, A. H. Jones, Y. Tan, A. K. Rockwell, S. D. March, S. R. Bank, A. W. Ghosh, and J. C. Campbell, "Full band Monte Carlo simulation of AlInAsSb digital alloys," InfoMat, vol. 2, no. 06, pp. 1236-1240, Nov 2020. Digital object identifier
  4. J. Zheng, S. Z. Ahmed, Y. Yuan, A. H. Jones, Y. Tan, A. K. Rockwell, S. D. March, S. R. Bank, A. W. Ghosh, and J. C. Campbell, "Full band Monte Carlo simulation of AlInAsSb digital alloys," InfoMat, vol. 2, no. 6, pp. 1236-1240, Mar 2020. Digital object identifier
  5. J. Zheng, A. H. Jones, Y. Tan, A. K. Rockwell, S. D. March, S. Z. Ahmed, C. A. Dukes, A. W. Ghosh, S. R. Bank, and J. C. Campbell, "Characterization of band offsets in AlxIn1-xAsySb1-y alloys with varying Al composition," Applied Physics Letters, vol. 115, no. 12, pp. 122105, Sep 2019. Digital object identifier

Conference Paper

  1. R. C. White, Q. Meng, M. Lopez, A. Ponnekanti, L. J. Nordin, A. J. Muhowski, D. Wasserman, S. R. Bank, and M. A. Wistey, "Growth and Characterization of InSbBi: A (Potentially) Not So Highly Mismatched Alloy for Wavelength Extension on InSb," 21st International Conference on Molecular Beam Epitaxy (ICMBE), Virtual, Sep 2021.
  2. Q. Meng, R. H. El-Jaroudi, I. A. Gulyas, R. C. White, K. M. McNicholas, T. Dey, S. R. Bank, and M. A. Wistey, "Effect of B-In interactions on the band structure and optical properties of BGa(In)As," 62nd Electronic Materials Conf. (EMC), Columbus, OH, Jun 2020.