Publications

Displaying 4 publications
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Journal Article

  1. J. Jeong, X. Meng, A. K. Rockwell, S. R. Bank, W. Hsieh, J. Lin, and Y. Wang, "Picosecond transient thermoreflectance for thermal conductivity characterization," Nanoscale and Microscale Thermophysical Engineering, vol. 0, no. 0, Feb 2019. Digital object identifier

Conference Paper

  1. A. F. Ricks, R. C. White, Q. Meng, H. Hijazi, M. A. Wistey, and S. R. Bank, "Bismuth Incorporation in AlInSb for an Improved Barrier Layer Material," 66th Electronic Materials Conf. (EMC), College Park, Maryland, Jun 2024.
  2. A. M. Skipper, Y. Fang, F. He, A. J. Muhowski, D. J. Ironside, D. Wasserman, Y. Wang, M. J. Rodwell, and S. R. Bank, "Monolithic Integration of Patterned Metal-Dielectric Stacks Overgrown with III-V Semiconductors by Molecular Beam Epitaxy," 62nd Electronic Materials Conf. (EMC), Columbus, OH, Jun 2020.
  3. A. M. Skipper, D. J. Ironside, Y. Fang, J. van. de Groep, J. Song, P. Dhingra, M. L. Lee, M. L. Brongersma, M. J. Rodwell, and S. R. Bank, "Epitaxial Integration of Arbitrarily Patterned Metal Nanostructures for Photonic Applications," 61st Electronic Materials Conf. (EMC), Ann Arbor, MI, Jun 2019.