Publications

Displaying 8 publications
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Journal Article

  1. D. Wei, B. Gao, A. A. Dadey, J. A. McArthur, J. Bai, S. R. Bank, and J. C. Campbell, "Broadband Quantum Efficiency Enhancement of AlInAsSb p–i–n Photodiodes with All-Dielectric Amorphous Germanium Metasurfaces," Adv. Phot. Res., Jun 2024. Digital object identifier
  2. D. Wei, A. A. Dadey, J. A. McArthur, S. R. Bank, and J. C. Campbell, "Enhancing Extended SWIR AlInAsSb PIN Photodetectors with All-Dielectric Amorphous Germanium Photon-Capturing Gratings," ACS Photonics, Jan 2024. Digital object identifier
  3. P. Kompella, B. Gracia, L. LeBlanc, S. Engelman, C. Kulkarni, N. Desai, V. June, S. D. March, S. Pattengale, G. Rodriguez-Rivera, S. Woo. Ryu, I. Strohkendl, P. Mandke, and G. Clark, "Interactive youth science workshops benefit student participants and graduate student mentors," PLOS Biology, vol. 18, no. 3, pp. 1-10, Mar 2020. Digital object identifier
  4. D. Wei, S. J. Maddox, P. Sohr, S. R. Bank, and S. Law, "Enlarged growth window for plasmonic silicon-doped InAs using a bismuth surfactant," Optical Materials Express, vol. 10, no. 2, pp. 302-311, Feb 2020. Digital object identifier

Conference Paper

  1. E. Y. Wang, H. Karimi, M. Waqar, X. Pan, J. C. Campbell, and S. R. Bank, "Growth and Characterization of Ternary-Containing AlInAsSb Digital Alloys," 66th Electronic Materials Conf. (EMC), College Park, Maryland, Jun 2024.
  2. E. Y. Wang, J. A. McArthur, H. Karimi, P. Devaney, J. C. Campbell, and S. R. Bank, "Effect of Varying Period Structure on Tunneling Current in AlInAsSb Digital Alloys," 66th Electronic Materials Conf. (EMC), College Park, Maryland, Jun 2024.
  3. J. A. McArthur, A. A. Dadey, E. Y. Wang, H. Karimi, J. C. Campbell, and S. R. Bank, "Suppressing AlInAsSb Avalanche Photodiode Dark Currents by Tuning the Absorption Region," 66th Electronic Materials Conf. (EMC), College Park, Maryland, Jun 2024.
  4. J. A. McArthur, H. Karimi, L. Sauer, J. C. Campbell, and S. R. Bank, "Manipulating the opto-electronic properties of AlInAsSb digital alloys by adjusting the period thickness," 65th Electronic Materials Conf. (EMC), Santa Barbara, CA, Jun 2023.