Publications

Displaying 3 publications
Quote related keywords (e.g. "66th Electronic Materials Conf.")

Conference Paper

  1. K. Li, E. Simmons, A. F. Briggs, S. R. Bank, E. E. Narimanov, V. A. Podolskly, and D. Wasserman, "Interrogating Hyperbolic Metamaterials with Integrated Intersubband Transitions Using Thermal Emission Spectroscopy," 61st Electronic Materials Conf. (EMC), Ann Arbor, MI, Jun 2019.
  2. S. D. Sifferman, J. W. Schwede, D. C. Riley, R. T. Howe, Z. Shen, N. A. Melosh, and S. R. Bank, "Compositionally-Graded Structures for Photon-Enhanced Thermionic Emitters," 56th Electronic Materials Conf. (EMC), Santa Barbara, CA, Jun 2014.
  3. S. Vaithilingam, I. O. Wygant, S. D. Sifferman, X. Zhuang, Y. Furukawa, O. Oralkan, S. Keren, S. S. Gambhir, and B. T. Khuri-Yakub, "Tomographic Photoacoustic Imaging Using Capacitive Micromachined Ultrasonic Transducer (CMUT) Technology," 2006 IEEE Ultrasonics Symposium, Ultrasonics Symposium, 2006. IEEE, pp. 397-400, Oct 2006.