Publications

Displaying 3 publications
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Conference Paper

  1. A. F. Ricks, R. C. White, Q. Meng, H. Hijazi, M. A. Wistey, and S. R. Bank, "Bismuth Incorporation in AlInSb for an Improved Barrier Layer Material," 66th Electronic Materials Conf. (EMC), College Park, Maryland, Jun 2024.
  2. K. Li, E. Simmons, A. F. Briggs, S. R. Bank, E. E. Narimanov, V. A. Podolskly, and D. Wasserman, "Interrogating Hyperbolic Metamaterials with Integrated Intersubband Transitions Using Thermal Emission Spectroscopy," 61st Electronic Materials Conf. (EMC), Ann Arbor, MI, Jun 2019.
  3. A. K. Rockwell, S. J. Maddox, D. Jung, Y. Sun, S. D. Sifferman, W. Sun, M. Ren, J. Guo, J. C. Campbell, M. L. Lee, and S. R. Bank, "The Effect of Period Thickness on AlInAsSb Digital Alloys on GaSb," 58th Electronic Materials Conf. (EMC), Newark, DE, Jun 2016.