Publications

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Conference Paper

  1. A. F. Briggs, K. J. Underwood, S. D. Sifferman, J. T. Gopinath, and S. R. Bank, "Comparison of Auger Recombination Across Material Systems with Externally Applied Biaxial Strain," 62nd Electronic Materials Conf. (EMC), Columbus, OH, Jun 2020.
  2. S. D. Sifferman, A. F. Briggs, S. J. Maddox, H. P. Nair, and S. R. Bank, "Highly strained, high indium content III-V materials toward 4-micron type-I emitters," Optical Materials Express, 62nd Electronic Materials Conf. (EMC), Columbus, OH, Jun 2020.