Publications

Displaying 1 publications
Quote related keywords (e.g. "66th Electronic Materials Conf.")

Conference Paper

  1. A. F. Briggs, K. J. Underwood, S. D. Sifferman, J. T. Gopinath, and S. R. Bank, "Comparison of Auger Recombination Across Material Systems with Externally Applied Biaxial Strain," 62nd Electronic Materials Conf. (EMC), Columbus, OH, Jun 2020.