Publications

Displaying 7 publications
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Journal Article

  1. E. M. Krivoy, S. Rahimi, H. P. Nair, R. Salas, S. J. Maddox, D. J. Ironside, Y. Jiang, G. Kelp, G. Shvets, D. Akinwande, and S. R. Bank, "Growth and characterization of single crystal rocksalt LaAs using LuAs barrier layers," APL, vol. 101, no. 22, pp. 221908, Nov 2012. Digital object identifier

Conference Paper

  1. A. M. García, B. D. Aguilar, W. J. Doyle, Y. Wang, D. J. Ironside, A. M. Skipper, M. K. Bergthold, M. L. Lee, D. Wasserman, and S. R. Bank, "Molecular Beam Epitaxy Selective Area Regrowth of High Aspect Ratio Microstructures for Mid-Infrared Optoelectronics," 66th Electronic Materials Conf. (EMC), College Park, Maryland, Jun 2024.
  2. M. C. Cassidy, J. Duncan, A. M. García, W. J. Doyle, D. Wasserman, and S. R. Bank, "Selective Area Regrowth for Chipscale Trapped Atom/Ion Quantum Systems," 66th Electronic Materials Conf. (EMC), College Park, Maryland, Jun 2024.
  3. E. M. Krivoy, H. P. Nair, A. M. Crook, S. Rahimi, Y. Jiang, S. J. Maddox, R. Salas, G. Kelp, G. Shvets, M. A. Belkin, D. Akinwande, and S. R. Bank, "Rare-earth monopnictide alloys for tunable epitaxial semimetals," North American Molecular Beam Epitaxy Conf. (NAMBE), Atlanta, GA, Oct 2012.
  4. E. M. Krivoy, H. P. Nair, S. J. Maddox, R. Salas, S. Rahimi, Y. Jiang, M. A. Belkin, D. Akinwande, and S. R. Bank, "Growth of high-quality rocksalt LaAs on LuAs seeded templates," 54th Electronic Materials Conf. (EMC), Jun 2012.
  5. E. M. Krivoy, H. P. Nair, A. M. Crook, S. Rahimi, Y. Jiang, S. J. Maddox, R. Salas, M. A. Belkin, D. Akinwande, and S. R. Bank, "Rare-earth monopnictides films for tunable frequency transparent Ohmic contacts," 54th Electronic Materials Conf. (EMC), Jun 2012.
  6. S. Vaithilingam, I. O. Wygant, S. D. Sifferman, X. Zhuang, Y. Furukawa, O. Oralkan, S. Keren, S. S. Gambhir, and B. T. Khuri-Yakub, "Tomographic Photoacoustic Imaging Using Capacitive Micromachined Ultrasonic Transducer (CMUT) Technology," 2006 IEEE Ultrasonics Symposium, Ultrasonics Symposium, 2006. IEEE, pp. 397-400, Oct 2006.