Publications

Displaying 10 publications
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Conference Paper

  1. A. M. García, A. M. Skipper, D. J. Ironside, and S. R. Bank, "Feature-Independent Molecular Beam Epitaxy (MBE) Selective Area Regrowth Towards Embedding High Aspect Ratio Microstructures," 36th North American Molecular Beam Epitaxy Conf. (NAMBE), Rehoboth Beach, DE, Sep 2022.
  2. R. C. White, M. K. Bergthold, I. Okoro, Y. Wang, L. J. Nordin, A. J. Muhowski, A. F. Ricks, D. Wasserman, and S. R. Bank, "Towards Lattice-Matched Narrow Bandgap InAsSbBi Photodetectors," 36th North American Molecular Beam Epitaxy Conf. (NAMBE), Rehoboth Beach, DE, Sep 2022.
  3. A. F. Briggs, D. Silva, L. J. Nordin, D. Wasserman, and S. R. Bank, "Tunable InGaSb Emitters Coupled with InAs:Si through Molecular Beam Epitaxy," 61st Electronic Materials Conf. (EMC), Ann Arbor, MI, Jun 2019.
  4. A. F. Briggs, S. D. Sifferman, K. J. Underwood, J. T. Gopinath, and S. R. Bank, "Externally Applied Strain on GaSb Based InGaAsSb Quantum Well Membranes," 61st Electronic Materials Conf. (EMC), Ann Arbor, MI, Jun 2019.
  5. R. H. El-Jaroudi, K. M. McNicholas, B. A. Bouslog, J. Kopaczek, R. Kudrawiec, and S. R. Bank, "BGaInAs/GaAs quantum wells for 1. 3µm lasers," 61st Electronic Materials Conf. (EMC), Ann Arbor, MI, Jun 2019.
  6. K. Li, E. Simmons, A. F. Briggs, S. R. Bank, E. E. Narimanov, V. A. Podolskly, and D. Wasserman, "Interrogating Hyperbolic Metamaterials with Integrated Intersubband Transitions Using Thermal Emission Spectroscopy," 61st Electronic Materials Conf. (EMC), Ann Arbor, MI, Jun 2019.
  7. S. D. March, A. H. Jones, A. K. Rockwell, M. Ren, Y. Chen, M. E. Woodson, S. J. Maddox, J. C. Campbell, and S. R. Bank, "Modeling and Measurement of Carrier Trapping and Tunneling in AlxIn1-xAsySb1-y Digital Alloys," 61st Electronic Materials Conf. (EMC), Ann Arbor, MI, Jun 2019.
  8. K. M. McNicholas, R. H. El-Jaroudi, J. Kopaczek, A. H. Jones, D. J. Ironside, R. Judrawiec, J. C. Campbell, and S. R. Bank, "Progress towards B-III-V optoelectronic devices on silicon," 61st Electronic Materials Conf. (EMC), Ann Arbor, MI, Jun 2019.
  9. A. K. Rockwell, M. Ren, M. E. Woodson, A. H. Jones, S. D. March, Y. Tan, Y. Yuan, S. J. Maddox, A. W. Ghosh, J. C. Campbell, and S. R. Bank, "Band Structure Influence on Noise Properties of III-V Digital Alloys," 61st Electronic Materials Conf. (EMC), Ann Arbor, MI, Jun 2019.
  10. A. M. Skipper, D. J. Ironside, Y. Fang, J. van. de Groep, J. Song, P. Dhingra, M. L. Lee, M. L. Brongersma, M. J. Rodwell, and S. R. Bank, "Epitaxial Integration of Arbitrarily Patterned Metal Nanostructures for Photonic Applications," 61st Electronic Materials Conf. (EMC), Ann Arbor, MI, Jun 2019.