Publications
Conference Paper
- A. A. Dadey, S. D. March, X. Xue, S. R. Bank, and J. C. Campbell, "Cryogenic Noise of Staircase Avalanche Photodiodes," 2021 IEEE Photonics Conference (IPC), Vancouver, BC, Canada, Oct 2021.
- R. Wang, D. Chen, J. A. McArthur, X. Xue, S. R. Bank, and J. C. Campbell, "AlxIn1-xAsySb1-y digital alloy nBn photodetectors," 2021 IEEE Photonics Conference (IPC), Vancouver, BC, Canada, Oct 2021.
- M. Miscuglio, Z. Hu, S. Li, J. Gu, A. Babakhani, P. Gupta, C. Wong, D. Pan, S. R. Bank, H. Dalir, and V. J. Sorger, "Massive parallelism Fourier-optic convolutional processor," Signal Processing in Photonic Communications (SPPCOM), Washington, DC, Jul 2020.
- D. J. Ironside, E. M. Krivoy, V. D. Dasika, E. S. Walker, K. Nguyen, J. Jeong, Y. Wang, and S. R. Bank, "Tailored III-V Metamorphic Buffer Layers utilizing Embedded Rare Earth Monopnictides for Optoelectronic Applications," 57th Electronic Materials Conf. (EMC), Columbus, OH, Jun 2015.
- S. J. Maddox, S. D. March, W. Sun, J. C. Campbell, and S. R. Bank, "Growth and Properties of Broadly Tunable AlInAsSb Digital Alloys on GaSb," 57th Electronic Materials Conf. (EMC), Columbus, OH, Jun 2015.
- K. M. McNicholas, E. M. Krivoy, R. Salas, S. D. Sifferman, and S. R. Bank, "Tunable, lattice-matched, epitaxial semimetals," 57th Electronic Materials Conf. (EMC), Columbus, OH, Jun 2015.
- R. Salas, N. T. Sheehan, S. Guchhait, K. M. McNicholas, S. D. Sifferman, V. D. Dasika, E. M. Krivoy, and S. R. Bank, "Properties of Growth Enhanced ErAs:InGaAs Nanocomposites," 57th Electronic Materials Conf. (EMC), Columbus, OH, Jun 2015.
- S. D. Sifferman, R. Salas, S. J. Maddox, H. P. Nair, N. T. Sheehan, E. M. Krivoy, E. S. Walker, and S. R. Bank, "Surfactant-mediated growth of highly strained materials for mid-infrared applications," 57th Electronic Materials Conf. (EMC), Columbus, OH, Jun 2015.
- E. S. Walker, W. Li, S. Guchhait, M. N. Yogeesh, F. He, Y. Wang, D. Akinwande, and S. R. Bank, "In Situ Oxidation of Bismuth Thin Films Grown by Molecular Beam Epitaxy for Device Applications," 57th Electronic Materials Conf. (EMC), Columbus, OH, Jun 2015.