Publications
Conference Paper
- A. F. Briggs, L. J. Nordin, A. J. Muhowski, E. Simmons, P. Dhingra, M. L. Lee, V. A. Podolskiy, D. Wasserman, and S. R. Bank, "Enhanced double heterostructure infrared LEDs using monolithically integrated plasmonic materials," 63nd Electronic Materials Conf. (EMC), Virtual, Jun 2021.
- A. M. García, A. M. Skipper, D. J. Ironside, and S. R. Bank, "Experimentally-Calibrated Modeling of Molecular Beam Epitaxy Selective Area Regrowth," 63nd Electronic Materials Conf. (EMC), Virtual, Jun 2021.
- J. A. McArthur, S. D. March, D. Chen, A. A. Dadey, A. H. Jones, J. C. Campbell, and S. R. Bank, "Background Carrier Polarity Switching in AlInAsSb Digital Alloys," 63nd Electronic Materials Conf. (EMC), Virtual, Jun 2021.
- Q. Meng, R. H. El-Jaroudi, R. C. White, T. Dey, M. Shamim. Reza, S. R. Bank, and M. A. Wistey, "Effect of B Distribution on the Band Structure of BGa(In)As Alloys," 63nd Electronic Materials Conf. (EMC), Virtual, Jun 2021.
- A. M. Skipper, A. M. García, D. J. Ironside, D. Wasserman, and S. R. Bank, "Selective Area Doping and Lateral Overgrowth by Solid-Source Molecular Beam Epitaxy," 63nd Electronic Materials Conf. (EMC), Virtual, Jun 2021.
- R. C. White, A. J. Muhowski, L. J. Nordin, D. Wasserman, and S. R. Bank, "Growth Optimization of InSbBi Alloys for Wavelength Extension on InSb," 63nd Electronic Materials Conf. (EMC), Virtual, Jun 2021.
- K. Appaiah, R. Salas, S. Vishwanath, and S. R. Bank, "Enhancing data rates in graded-index multimode fibers with offset coupling and multiplexing," Optical Fiber Communication Conf. (OFC), Anaheim, CA, Mar 2013.
- S. R. Bank, H. P. Bae, H. B. Yuen, L. L. Goddard, M. A. Wistey, T. Sarmiento, and J. S. Harris, "Low-Threshold CW 1. 55-\µm GaAs-Based Lasers," Optical Fiber Communication Conf. (OFC), Anaheim, CA, Mar 2006.
- S. R. Bank, M. A. Wistey, H. B. Yuen, L. L. Goddard, and J. S. Harris, "Progress Towards High Power 1. 5 \µm GaInNAsSb/GaAs Lasers for Raman Amplifiers," Optical Fiber Communication Conf. (OFC), Los Angeles, CA, Feb 2004.